Reflow & Wet Blast
반도체 패키징 공정에서 열을 사용하여
범프(bump)형성 및 플립칩(Flip Chip) 공정을 진행하는 장비
브로셔다운로드
범프(bump)형성 및 플립칩(Flip Chip) 공정을 진행하는 장비
브로셔다운로드
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Application
- Fluxless Reflow for solder Bump Ball, Cu pillar & CoW Chip Bonding of the HBM
- Vacuum or ATM Reflow System -
Advantages
- Void-free Bump Ball Performance
- Various Temperature Profile (Step & Slope Type)
- Outstanding O2 Density Control(<1ppm) at Every Process
- Conduction & Convection Heating Chamber System
- No Chip Sliding on the Flip Chip Process
- Temp Control : 250±1% (Max.450℃) Real Time Monitoring of Process Wafer Temp.
- Process gas : Formic acid or no Reactant gas
- Process Pressure : Vaccum / ATM Process
- EFEM(2 or 3 Port) : SEMI Standards
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