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Applications

  • Fluxless/Flux(Lead free) reflow for solder bump ball, CU pillar & micro bump
  • Vacuum reflow system(Model : SRS30V))

Advantage

  • Void-free bump ball connection
  • Void-free bump ball performance
  • Vacuum reflow system by dry pump(~3mTorr)
  • Various temp. profile(Step & Slope type)
  • Outstanding O2 density control(1ppm) at every process : to improve process quality

Foot Print

  • Foot print : 2,350*2,520*2,800(W*H*D)
  • Temp. control : 250ɡ1%(Max. 450)
    Real time monitoring of process wafer temp.
  • Process gas : Formic acid or no reactant gas
  • Process pressure : Low pressure(Model : SRS30V)
    Normal pressure(Model : SRS300).
  • EFEM(2 or 3 port) : SEMI Standards.